Patent
   D573112
Priority
Sep 03 2007
Filed
Sep 03 2007
Issued
Jul 15 2008
Expiry
Jul 15 2022
Assg.orig
Entity
unknown
3
8
n/a
The ornamental design for a heat dissipation device, as shown and described.

FIG. 1 is a perspective view of a heat dissipation device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof, showing a cooling fan being mounted to the heat dissipation device, wherein the cooling fan is shown in broken lines for illustrative environmental purposes only and forms no part of the claimed design.

Xu, Hong-Bo

Patent Priority Assignee Title
D593044, Feb 01 2008 Neobulb Technologies, Inc. Light emitting module
D642316, Apr 20 2010 Foxconn Technology Co., Ltd. LED lamp
D906268, Sep 11 2018 Rheem Manufacturing Company Heat exchanger fin
Patent Priority Assignee Title
6860321, Jan 30 2003 Molex Incorporated Heat-dissipating device
6942020, Jul 16 2003 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device
7068512, Dec 26 2003 Gold Charm Limited Heat dissipation device incorporating with protective cover
20050056400,
20050247437,
20060070721,
20060082972,
20060102324,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 27 2007XU, HONG-BOHON HAI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0197760212 pdf
Sep 03 2007Hon Hai Precision Industry Co., Ltd.(assignment on the face of the patent)
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