Patent
   D576953
Priority
Sep 21 2007
Filed
Sep 21 2007
Issued
Sep 16 2008
Expiry
Sep 16 2022
Assg.orig
Entity
unknown
1
9
n/a
The ornamental design for a sim card connector, as shown and described.

FIG. 1 is a perspective view of a SIM card connector showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another perspective view of the SIM card connector showing our new design.

The broken line of the internal elements of the connector in FIG. 7 is included to show unclaimed subject matter only and forms no part of the claimed design.

Gao, Ni, Liao, Wei Hong

Patent Priority Assignee Title
D704142, Mar 19 2013 UJU Electronics Co. Ltd. Socket housing for communication device
Patent Priority Assignee Title
6149466, May 13 1997 CoActive Technologies, Inc Compact smart card electrical connector
6382995, May 20 1999 CoActive Technologies, Inc Smart card connector with retain and eject means
6994566, Nov 15 2002 Molex Incorporated Circuit board mounted electrical connector
D491893, Nov 12 2002 Advanced Connectek, Inc.; Advanced Connectek, Inc SIM card connector
D494140, Jul 05 2002 Subscriber identification module
D523860, Dec 15 2004 Hon Hai Precision Ind., Co., Ltd. Electrical card connector
D530284, Dec 27 2005 Cheng Uei Precision Industry Co., Ltd. SIM card connector
D544842, Feb 10 2006 Mitsumi Electric Co., Ltd. Connector
D547728, Nov 24 2006 Cheng Uei Precision Industry Co., Ltd. Memory card connector
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 14 2007GAO, NICHENG UEI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0199590654 pdf
Sep 14 2007LIAO, WEI HONGCHENG UEI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0199590654 pdf
Sep 21 2007Cheng Uei Precision Industry Co., Ltd.(assignment on the face of the patent)
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