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Patent
D582576
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Priority
Apr 03 2008
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Filed
Apr 03 2008
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Issued
Dec 09 2008
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Expiry
Dec 09 2022
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Assg.orig
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Entity
unknown
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3
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The ornamental design for a linear type light emitting diode assembly with heat dissipating module, as shown and described.
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FIG. 1 is a perspective view of a linear type light emitting diode assembly with heat dissipating module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom side elevational view thereof; and,
FIG. 7 is a top side elevational view thereof.
Liao, Hung-Ta, Chen, Pao-Shen
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