Patent
   D585393
Priority
Aug 03 2007
Filed
Oct 21 2007
Issued
Jan 27 2009
Expiry
Jan 27 2023
Assg.orig
Entity
unknown
0
8
n/a
The ornamental design for an electronic component cooling apparatus, as shown and described.

FIG. 1 is a perspective view of an electronic component cooling apparatus showing the new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line shown in FIG. 5 is for illustrative purposes only and forms no part of the claimed design.

Jeng, Yuh-Wen, Tzeng, Guo-Shiung

Patent Priority Assignee Title
Patent Priority Assignee Title
6779595, Sep 16 2003 CPUMate Inc. Integrated heat dissipation apparatus
6883592, Nov 04 1998 ZALMAN TECH CO , LTD Heatsink for electronic component
6918429, Nov 05 2003 CPUMate Inc. Dual-layer heat dissipating structure
6955214, Dec 15 2003 Radiator with seamless heat conductor
20020043360,
20030019610,
D467559, Feb 23 2001 Zalman Tech Co., Ltd., Radiator for heat generating components in electronic equipment
D533145, Aug 04 2005 Molex Incorporated Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 17 2007JENG, YUH-WENAMA PRECISION INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0200630335 pdf
Sep 17 2007TZENG, GUO-SHIUNGAMA PRECISION INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0200630335 pdf
Oct 21 2007AMA Precision Inc.(assignment on the face of the patent)
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