Patent
   D592230
Priority
May 16 2007
Filed
Nov 16 2007
Issued
May 12 2009
Expiry
May 12 2023
Assg.orig
Entity
unknown
4
5
n/a
The ornamental design for a wafer carrying-in/out machine, as shown and described.

FIG. 1 is a top plan view of a wafer carrying-in/out machine or the like, showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a top, front and left side perspective view thereof;

FIG. 7 is a front elevational view thereof; and,

FIG. 8 is a left side elevation thereof showing the wafer carrying-in/out machine when ready for shipment.

The phantom line showing in the figures is hereby disclaimed and forms no part of the claimed invention.

Akiyama, Shuji, Hosaka, Hiroki, Obikane, Tadashi

Patent Priority Assignee Title
D700638, Feb 13 2012 MASTERWORK MACHINERY CO , LTD Die cutting machine with stripping and blanking
D905138, Feb 13 2019 System 3R International AB Pallet changer
D905139, Feb 13 2019 Agie Charmilles SA Electrical discharge machine
D905140, Feb 13 2019 GF MACHINING SOLUTIONS AG Milling machine
Patent Priority Assignee Title
5645233, Apr 02 1996 Apparatus for recycling scrapped polylon
D388103, Jan 22 1996 Mitsubishi Denki Kabushiki Kaisha Electrical discharge machine
D405809, Mar 14 1996 AGIE SA Electro-erosive wire cutting machine
D406155, Mar 14 1996 AGIE SA Electro-erosion die-sinking machine
EM6054310001,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 05 2007HOSAKA, HIROKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0204010386 pdf
Oct 05 2007AKIYAMA, SHUJITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0204010386 pdf
Nov 16 2007Tokyo Electron Limited(assignment on the face of the patent)
Nov 22 2007OBIKANE, TADASHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0204010386 pdf
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