The ornamental design for a grinderpumpassembly, as shown and described.
This application incorporates by reference concurrently filed U.S. patent application Ser. No. 11/748,231, entitled “Wireless Liquid Level Sensing Assemblies And Grinder Pump Assemblies Employing The Same” by Capano et al. All the material from the concurrently filed U.S. patent application Ser. No. 11/748,231, entitled “Wireless Liquid Level Sensing Assemblies And Grinder Pump Assemblies Employing The Same” by Capano et al. which is essential to the claimed design is included in this application. It is understood that any material in the concurrently filed U.S. patent application Ser. No. 11/748,231, entitled “Wireless Liquid Level Sensing Assemblies And Grinder Pump Assemblies Employing The Same” by Capano et al. which is not present in this application forms no part of the claimed design.
FIG. 1 is a perspective view of a grinder pump assembly in accordance with the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom view; and,
FIG. 7 is a perspective view of the grinder pump assembly of FIG. 1 shown in an alternative configuration of use.
The broken lines in the figures are for illustration purposes only and form no part of the claimed invention.