Patent
   D595740
Priority
Feb 04 2008
Filed
May 15 2008
Issued
Jul 07 2009
Expiry
Jul 07 2023
Assg.orig
Entity
unknown
5
2
n/a
The ornamental design for a rotor end cover, as shown and described.

FIG. 1 is a perspective view of the rotor end cover, representing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof; and,

FIG. 4 is a top plan view thereof.

Chen, I-Hsing, Yang, Shih-Jen, Tu, Hung-Sen, Yang, Chen-Chia

Patent Priority Assignee Title
D639308, May 31 2010 JOHNSON ELECTRIC INTERNATIONAL AG Lamination for an electric motor
D639309, May 31 2010 JOHNSON ELECTRIC INTERNATIONAL AG Lamination for an electric motor
D655722, Jul 06 2011 Samsung Electro-Mechanics Co., Ltd. Stator core plate for electric motor
D941767, Feb 27 2020 Mitsubishi Electric Corporation Rotor of fan motor for air conditioner
D941768, Feb 27 2020 Mitsubishi Electric Corporation Rotor of fan motor for air conditioner
Patent Priority Assignee Title
5452997, Jan 13 1994 COMERICA BANK, AS AGENT Rotary device with thermally compensated seal
5988993, Nov 28 1994 ENERGY RECOVERY, INC Pressure exchanger having a rotor with automatic axial alignment
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Feb 25 2008TU, HUNG-SENSystem General CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0209850917 pdf
Feb 25 2008YANG, CHEN-CHIASystem General CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0209850917 pdf
Feb 25 2008CHEN, I-HSINGSystem General CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0209850917 pdf
Feb 25 2008YANG, SHIH-JENSystem General CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0209850917 pdf
May 15 2008System General Corporation(assignment on the face of the patent)
Jun 20 2014System General CorporationFAIRCHILD TAIWAN CORPORATIONCHANGE OF NAME SEE DOCUMENT FOR DETAILS 0385990043 pdf
Dec 21 2016FAIRCHILD TAIWAN CORPORATION FORMERLY SYSTEM GENERAL CORPORATION Semiconductor Components Industries, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0423280318 pdf
Feb 10 2017Semiconductor Components Industries, LLCDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTPATENT SECURITY AGREEMENT0464100933 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTSemiconductor Components Industries, LLCRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RECORDED AT REEL 046410, FRAME 09330640720001 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTFairchild Semiconductor CorporationRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RECORDED AT REEL 046410, FRAME 09330640720001 pdf
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