Patent
   D596735
Priority
Jul 03 2008
Filed
Jul 03 2008
Issued
Jul 21 2009
Expiry
Jul 21 2023
Assg.orig
Entity
unknown
6
3
n/a
The ornamental design for a heat dissipating fan, as shown and described.

FIG. 1 is a perspective view of a heat dissipating fan.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a right side elevational view thereof.

FIG. 5 is a left side elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Su, Yen-Wen

Patent Priority Assignee Title
D723151, Dec 13 2013 Cooler Master Co., Ltd. Fan
D732655, Nov 21 2013 SANYO DENKI CO LTD Fan
D957613, Mar 11 2021 Corsair Memory, Inc. Computer fan
D972122, May 29 2019 Nidec Servo Corporation Fan case
ER6568,
ER756,
Patent Priority Assignee Title
5335722, Sep 30 1993 Global Win Technology Co., Ltd; Huei Bin Enterprise Corp. Cooling assembly for an integrated circuit
6525939, Aug 08 2000 Wistron Corporation; Acer Incorporated Heat sink apparatus
6587341, Mar 04 2002 Chun Long Metal Co., Ltd. Heat dissipater structure
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Apr 02 2008SU, YEN-WENEnermax Technology CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0211950619 pdf
Jul 03 2008Enermax Technology Corporation(assignment on the face of the patent)
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