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Patent
D602882
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Priority
Mar 30 2006
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Filed
Aug 04 2008
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Issued
Oct 27 2009
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Expiry
Oct 27 2023
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Assg.orig
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Entity
unknown
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0
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14
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n/a
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The ornamental design for a wafer carrying-in/out apparatus or the like, as shown and described.
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FIG. 1 is a front elevational view of a wafer carrying-in/out apparatus showing our design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top, front and right side perspective view thereof; and,
FIG. 8 is a top, front and right side perspective view thereof shown with the doors thereof in an open position.
Akiyama, Shuji, Hosaka, Hiroki, Obikane, Tadashi
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
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Jun 15 1992 |
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Mar 04 1994 |
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Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface |
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Jun 04 1997 |
SpeedFam-IPEC Corporation |
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Nov 14 1995 |
Nikon Corporation |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 04 2008 | | Tokyo Electron Limited | (assignment on the face of the patent) | | / |
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Maintenance Fee Events |
n/a
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Maintenance Schedule |
n/a