Patent
   D605611
Priority
Jun 25 2008
Filed
Dec 08 2008
Issued
Dec 08 2009
Expiry
Dec 08 2023
Assg.orig
Entity
unknown
0
8
n/a
The ornamental design for a light emitting diode, as shown and described.

FIG. 1 is a perspective view of a light emitting diode.

FIG. 2 is a front elevational view of the light emitting diode.

FIG. 3 is a rear elevational view of the light emitting diode.

FIG. 4 is a left side elevational view of the light emitting diode.

FIG. 5 is a top plan view of the light emitting diode.

FIG. 6 is a bottom plan view of the light emitting diode.

FIG. 7 is a reference perspective view from a bottom view of FIG. 1; and,

FIG. 8 is a reference sectional view taken along line 88 of FIG. 5.

A right side elevational view is omitted because it is symmetrical to the view shown in FIG. 4.

Park, Kwang-Il

Patent Priority Assignee Title
Patent Priority Assignee Title
4959761, Dec 21 1989 Dialight Corporation Surface mounted led package
6486543, May 20 1998 Rohm Co., Ltd. Packaged semiconductor device having bent leads
7001046, Nov 29 2002 TOYODA GOSEI CO , LTD ; E-TECH CO , LTD Led lamp
20040070338,
20050242708,
20060157726,
D471166, Apr 06 2001 Kabushiki Kaisha Toshiba Light emitting semiconductor device
D508233, Feb 26 2003 Nichia Corporation Light emitting diode
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Nov 28 2008PARK, KWANG ILSEOUL SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0224190686 pdf
Dec 08 2008Seoul Semiconductor Co., Ltd.(assignment on the face of the patent)
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