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Patent
D606502
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Priority
Oct 27 2008
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Filed
Oct 27 2008
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Issued
Dec 22 2009
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Expiry
Dec 22 2023
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Assg.orig
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Entity
unknown
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6
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7
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n/a
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The ornamental design for a heat dissipating unit, as shown and described.
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FIG. 1 is a perspective view of a heat dissipating unit showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side, elevational view thereof;
FIG. 5 is a right-side, elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing of portion of the heat dissipating unit is for illustrative purpose only and forms no part of the claimed design.
Wang, Peng, Li, Sheng, Gu, Xiaodong, Wang, Yinghua, Chen, Bishou
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D624692, |
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D625876, |
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D640820, |
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D657089, |
Apr 10 2010 |
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D657090, |
Aug 03 2009 |
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D681259, |
Apr 10 2010 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
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Patent |
Priority |
Assignee |
Title |
6330908, |
Mar 15 2000 |
Foxconn Precision Components Co., Ltd. |
Heat sink |
6557626, |
Jan 11 2000 |
Molex Incorporated |
Heat sink retainer and Heat sink assembly using same |
7038913, |
Jan 15 2003 |
Hon Hai Precision Ind. Co., Ltd. |
Heat dissipation assembly including heat sink and fan |
20040226690, |
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20060060332, |
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20070253202, |
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D481688, |
Aug 30 2002 |
Hon Hai Precision Ind. Co., Ltd. |
Heat sink |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 27 2008 | | Shanghai Sansi Technology Co., Ltd | (assignment on the face of the patent) | | / |
Oct 27 2008 | | Shanghai Sansi Electronics Engineering Co., Ltd | (assignment on the face of the patent) | | / |
Oct 29 2008 | LI, SHENG | SHANGHAI SANSI ELECTRONICS ENGINEERING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | WANG, PENG | SHANGHAI SANSI ELECTRONICS ENGINEERING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | WANG, YINGHUA | SHANGHAI SANSI ELECTRONICS ENGINEERING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | CHEN, BISHOU | SHANGHAI SANSI ELECTRONICS ENGINEERING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | GU, XIAODONG | SHANGHAI SANSI TECHNOLOGY CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | LI, SHENG | SHANGHAI SANSI TECHNOLOGY CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | WANG, PENG | SHANGHAI SANSI TECHNOLOGY CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | WANG, YINGHUA | SHANGHAI SANSI TECHNOLOGY CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | CHEN, BISHOU | SHANGHAI SANSI TECHNOLOGY CO LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
Oct 29 2008 | GU, XIAODONG | SHANGHAI SANSI ELECTRONICS ENGINEERING CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022065 | /0490 |
pdf |
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