Patent
   D608308
Priority
Dec 12 2008
Filed
Jan 21 2009
Issued
Jan 19 2010
Expiry
Jan 19 2024
Assg.orig
Entity
unknown
8
4
n/a
The ornamental design for a light emitting diode package, as shown.

FIG. 1 is a perspective view of a light emitting diode package showing the new design.

FIG. 2 is a front view thereof.

FIG. 3 is a rear view thereof.

FIG. 4 is a left side view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a top view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is another perspective view thereof.

Hsieh, Chung-Chuan

Patent Priority Assignee Title
D615935, Oct 01 2009 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Light-emitting diode (LED)
D630777, Jul 13 2009 SUZHOU LEKIN SEMICONDUCTOR CO , LTD Light-emitting diode (LED)
D634284, Feb 10 2010 Lextar Electronics Corporation Lead frame
D634285, Feb 10 2010 Lextar Electronics Corporation Lead frame
D634286, Feb 10 2010 Lextar Electronics Corporation Lead frame
D638378, Feb 10 2010 Lextar Electronics Corporation Lead frame
D668624, Jul 25 2011 Lextar Electronics Corp. Light emitting diode package
D759884, Dec 16 2014 Hon Hai Precision Industry Co., Ltd. LED encapsulation structure
Patent Priority Assignee Title
D512693, Jun 28 2004 SAMSUNG ELECTRONICS CO , LTD Light-emitting diode
D519943, Dec 28 2001 Nichia Corporation Light emitting diode
D597499, Dec 27 2007 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Light emitting diode
D598872, Oct 29 2007 ALTI-SEMICONDUCTOR CO , LTD Light emitting diode
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 14 2009HSIEH, CHUNG-CHUANEVERLIGHT ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0222000449 pdf
Jan 21 2009Everlight Electronics Co., Ltd(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule