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The ornamental design for a package for electronic device, as shown and described.
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Those portions of the package for electronic device shown in broken lines are included for illustrative purposes only and form no part of the claimed design.
Lee, Teck Sim, Schredl, Juergen, Griebl, Erich, Feldvoss, Mario
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 04 2008 | SCHREDL, JUERGEN | Infineon Technologies AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022229 | /0234 | |
Nov 10 2008 | GRIEBL, ERICH | Infineon Technologies AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022229 | /0234 | |
Nov 11 2008 | FELDVOSS, MARIO | Infineon Technologies AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022229 | /0234 | |
Nov 12 2008 | LEE, TECK SIM | Infineon Technologies AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022229 | /0234 | |
Nov 14 2008 | Infineon Technologies AG | (assignment on the face of the patent) | / |
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