Patent
   D611014
Priority
Jun 13 2008
Filed
Jun 13 2008
Issued
Mar 02 2010
Expiry
Mar 02 2024
Assg.orig
Entity
unknown
6
10
n/a
The ornamental design for a circuit board module, as shown and described.

FIG. 1 is a perspective view of a circuit board module showing my new design;

FIG. 2 is a front view of a circuit board module;

FIG. 3 is a left view of a circuit board module;

FIG. 4 is a right view of a circuit board module; and,

FIG. 5 is a top view of a circuit board module.

Huang, Kuo-An

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Patent Priority Assignee Title
6232560, Dec 08 1998 Hon Hai Precision Ind. Co., Ltd. Arrangement of printed circuit traces
6609915, Nov 30 2001 SANMINA CORPORATION Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
7435097, Jan 12 2005 Legacy Electronics, Inc Radial circuit board, system, and methods
20060072293,
20070097656,
20080088597,
20080142352,
20090051647,
D531139, Oct 14 2004 Toshiba Lighting & Technology Corporation Light emitting diode module
D552566, Sep 16 2005 Toshiba Lighting & Technology Corporation Light emitting diode module
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 13 2008Kuo-An, Huang(assignment on the face of the patent)
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