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Patent
D611014
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Priority
Jun 13 2008
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Filed
Jun 13 2008
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Issued
Mar 02 2010
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Expiry
Mar 02 2024
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Assg.orig
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Entity
unknown
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6
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10
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n/a
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The ornamental design for a circuit board module, as shown and described.
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FIG. 1 is a perspective view of a circuit board module showing my new design;
FIG. 2 is a front view of a circuit board module;
FIG. 3 is a left view of a circuit board module;
FIG. 4 is a right view of a circuit board module; and,
FIG. 5 is a top view of a circuit board module.
Huang, Kuo-An
Patent |
Priority |
Assignee |
Title |
6232560, |
Dec 08 1998 |
Hon Hai Precision Ind. Co., Ltd. |
Arrangement of printed circuit traces |
6609915, |
Nov 30 2001 |
SANMINA CORPORATION |
Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same |
7435097, |
Jan 12 2005 |
Legacy Electronics, Inc |
Radial circuit board, system, and methods |
20060072293, |
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20070097656, |
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20080088597, |
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20080142352, |
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20090051647, |
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D531139, |
Oct 14 2004 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
D552566, |
Sep 16 2005 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 13 2008 | | Kuo-An, Huang | (assignment on the face of the patent) | | / |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a