Patent
   D612343
Priority
Jun 05 2009
Filed
Jul 08 2009
Issued
Mar 23 2010
Expiry
Mar 23 2024
Assg.orig
Entity
unknown
1
8
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Wei, An-Chi, Lin, Shan-Ju

Patent Priority Assignee Title
D696211, Oct 14 2011 Korea Bundy Co., Ltd. Heat exchange tube
Patent Priority Assignee Title
6637502, Apr 16 2002 Thermal Corp. Heat sink with converging device
6735864, Jan 26 2000 Matsushita Electric Industrial Co., Ltd. Heatsink method of manufacturing the same and cooling apparatus using the same
6899164, Feb 27 2004 Datech Technology Co., Ltd. Heat sink with guiding fins
7152666, Nov 14 2003 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Heat sink
7509995, May 06 2004 Delphi Technologies, Inc. Heat dissipation element for cooling electronic devices
20030070790,
20090139690,
D581376, Nov 08 2007 ABL IP Holding LLC Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 06 2009WEI, AN-CHIFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229310661 pdf
Jul 06 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229310661 pdf
Jul 08 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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