Heat dissipation device

The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Patent

Priority

Assignee

Title

Patent	Priority	Assignee	Title
6637502,	Apr 16 2002	Thermal Corp.	Heat sink with converging device
6735864,	Jan 26 2000	Matsushita Electric Industrial Co., Ltd.	Heatsink method of manufacturing the same and cooling apparatus using the same
6899164,	Feb 27 2004	Datech Technology Co., Ltd.	Heat sink with guiding fins
7152666,	Nov 14 2003	FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD	Heat sink
7509995,	May 06 2004	Delphi Technologies, Inc.	Heat dissipation element for cooling electronic devices
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20090139690,
D581376,	Nov 08 2007	ABL IP Holding LLC	Heat sink

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Jul 06 2009	WEI, AN-CHI	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022931	0649	pdf
Jul 06 2009	LIN, SHAN-JU	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	022931	0649	pdf
Jul 08 2009		Foxsemicon Integrated Technology, Inc.	(assignment on the face of the patent)

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