Patent
   D612879
Priority
Oct 18 1920
Filed
Apr 04 2006
Issued
Mar 30 2010
Expiry
Mar 30 2024
Assg.orig
Entity
unknown
1
4
n/a
The ornamental design for a semiconductor wafer inspection apparatus, as shown and described.

FIG. 1 is a front elevational view of a semiconductor wafer inspection apparatus, showing my new design;

FIG. 2 is a bottom view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a perspective view thereof.

The broken line showing in each of the figures is for illustrative purposes only and forms no part of the claimed design.

Nagasaka, Munetoshi

Patent Priority Assignee Title
ER8863,
Patent Priority Assignee Title
5465145, Oct 18 1993 Mitsubishi Denki Kabushiki Kaisha; Ryoden Semiconductor System Engineering Corporation Semiconductor wafer inspection apparatus
6906794, Sep 19 2001 Olympus Corporation Semiconductor wafer inspection apparatus
20050062960,
20080246497,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 04 2006Tokyo Electron Limited(assignment on the face of the patent)
May 25 2006NAGASAKA, MUNETOSHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0179980095 pdf
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