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Patent
   D613294
Priority
Sep 08 2006
Filed
Sep 08 2006
Issued
Apr 06 2010
Expiry
Apr 06 2024
Inventors
Lam, Lawre…
Assg.orig
Palm, Inc.
Assg.curr
Qualcomm I…
Entity
unknown
Referenced by
3
References
93
Maint.:
n/a
The ornamental design for a housing for a mobile computing device, as shown and described.

FIG. 1 is a front isometric view of a housing for a mobile computing device;

FIG. 2 is a front view of the housing of FIG. 1;

FIG. 3 is a bottom side view of the housing of FIG. 1;

FIG. 4 is a top side view of the housing of FIG. 1;

FIG. 5 is a first side view of the housing of FIG. 1; and,

FIG. 6 is a second side view of the housing of FIG. 1.

The broken line showing of portions of a mobile computing device forms no part of the claimed design.
INVENTORS:

Lam, Lawrence, Lee, Stephen, Hulik, Troy

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
8385057, Jun 08 2010 Qualcomm Incorporated Fully extendable dual-segmented housing assembly for mobile computing device
D732526, Apr 16 2013 Intel Corporation Computing device with sensor
D745508, Mar 15 2013 Intel Corporation Computing device with sensor
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ASSIGNMENT RECORDS    Assignment records on the USPTO
/////////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 08 2006Palm, Inc.(assignment on the face of the patent)
Dec 01 2006LEE, STEPHENPalm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0189320246 pdf
Dec 22 2006HULICK, TROYPalm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0189320246 pdf
Feb 22 2007LAM, LAWRENCEPalm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0189320246 pdf
Oct 24 2007Palm, IncJPMORGAN CHASE BANK, N A SECURITY AGREEMENT0203190568 pdf
Jul 01 2010JPMORGAN CHASE BANK, N A , AS ADMINISTRATIVE AGENTPalm, IncRELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0246300474 pdf
Oct 27 2010Palm, IncHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0252040809 pdf
Apr 30 2013HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Palm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0303410459 pdf
Dec 18 2013HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Palm, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0318370544 pdf
Dec 18 2013Palm, IncHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0318370239 pdf
Jan 23 2014Hewlett-Packard CompanyQualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321320001 pdf
Jan 23 2014HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Qualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321320001 pdf
Jan 23 2014Palm, IncQualcomm IncorporatedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0321320001 pdf
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