FIG. 1 is a front isometric view of a end section of a power supply plug showing the new design;
FIG. 2 is rear isometric view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a front elevational view thereof;
FIG. 8 is a front elevational view of a second embodiment of FIG. 1;
FIG. 9 is front isometric view of FIG. 8;
FIG. 10 is a top plan view of FIG. 1, aligned to receive and mate with a connector;
FIG. 11 is a right side elevational view of FIG. 10;
FIG. 12 is a front isometric view of FIG. 10;
FIG. 13 is a rear isometric view of FIG. 10;
FIG. 14 is a top plan view of FIG. 8 having a connector inserted and mated;
FIG. 15 is a right side view of FIG. 14;
FIG. 16 is a front isometric view of FIG. 14; and,
FIG. 17 is a rear isometric view of FIG. 14.
The bottom, right and left side views of embodiment 2 are identical to first embodiment.
The stipple shading represents contrast in color and texture.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 28 2008 | | Palm, Inc. | (assignment on the face of the patent) | | / |
Aug 28 2008 | MATSUOKA, YOSHIMICHI | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 021459 | /0402 |
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Oct 02 2009 | Palm, Inc | JPMORGAN CHASE BANK, N A | SECURITY AGREEMENT | 023406 | /0671 |
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Jul 01 2010 | JPMORGAN CHASE BANK, N A , AS ADMINISTRATIVE AGENT | Palm, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 024630 | /0474 |
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Oct 27 2010 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025204 | /0809 |
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Apr 30 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030341 | /0459 |
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Dec 18 2013 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0239 |
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Dec 18 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0544 |
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Jan 23 2014 | Hewlett-Packard Company | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | /0001 |
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Jan 23 2014 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | /0001 |
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Jan 23 2014 | Palm, Inc | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032132 | /0001 |
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