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Patent
D614590
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Priority
Jul 03 2009
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Filed
Jul 03 2009
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Issued
Apr 27 2010
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Expiry
Apr 27 2024
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Assg.orig
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Entity
unknown
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3
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9
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n/a
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I claim the ornamental design for a thermo electric heat transfer system, as shown and described.
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FIG. 1 is an isometric perspective view of this invention in a heat transfer mode.
FIG. 2 is a front elevation thereof.
FIG. 3 is a side elevation thereof.
FIG. 4 is an isometric perspective view of this invention in a cooling (Reverse Heat Transfer) mode to that of FIG. 1.
FIG. 5 is bottom plan of FIG. 4
FIG. 6 is top plan thereof; and,
FIG. 7 is an exploded view of FIG. 4.
Lee, Yong Nak
Patent |
Priority |
Assignee |
Title |
5787971, |
Mar 05 1996 |
OCZ TECHNOLOGY GROUP, INC |
Multiple fan cooling device |
5953209, |
Dec 15 1997 |
Intel Corporation |
Push and pull dual-fan heat sink design |
6021844, |
Jun 03 1998 |
|
Heat exchange apparatus |
6556442, |
Jun 19 2001 |
Global WIN Technology Co. Ltd. |
CPU cooling structure |
7046515, |
Jun 06 2002 |
OL SECURITY LIMITED LIABILITY COMPANY |
Method and apparatus for cooling a circuit component |
20040035560, |
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20080266793, |
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D398977, |
Oct 07 1997 |
Sunonwealth Electric Machine Industry Co., Ltd. |
Heat dissipation fan |
D509194, |
Oct 15 2003 |
AsusTek Computer Inc. |
Thermal module |
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