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Patent
D616380
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Priority
Jun 18 2009
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Filed
Sep 29 2009
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Issued
May 25 2010
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Expiry
May 25 2024
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Assg.orig
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Entity
unknown
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2
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11
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n/a
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The ornamental design for a heat dissipation device, as shown.
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FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Lin, Shan-Ju, Chang, Hsueh-Chen
Patent |
Priority |
Assignee |
Title |
5464054, |
Aug 09 1993 |
ANTARES CAPITAL LP, AS SUCCESSOR AGENT |
Spring clamp and heat sink assembly |
6196302, |
Mar 16 1999 |
|
Heat sink with multi-layer dispersion space |
6343014, |
Aug 11 2000 |
Ming-Chuan, Yu |
CPU cooling arrangement |
6648065, |
May 18 2001 |
Delta Electronics, Inc. |
Heat-dissipating module |
6874566, |
Sep 19 2003 |
Dell Products L.P. |
Heat sink with intermediate fan element |
7440282, |
May 16 2006 |
DELPHI TECHNOLOGIES IP LIMITED |
Heat sink electronic package having compliant pedestal |
20050078456, |
|
|
|
D286396, |
Feb 29 1984 |
ABB INSTRUMENTATION INC |
Power supply heat sink |
D376132, |
Dec 27 1995 |
|
Heatsink-outfitted speed controller housing |
D378815, |
Jun 19 1995 |
OCZ TECHNOLOGY GROUP, INC |
Heat sink |
D529873, |
May 14 2005 |
Foxconn Technology Co., Ltd. |
Heat sink |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a