Patent
   D616382
Priority
Jul 21 2009
Filed
Oct 26 2009
Issued
May 25 2010
Expiry
May 25 2024
Assg.orig
Entity
unknown
36
15
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Yang, Hong-Bin, Lin, Shan-Ju

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 19 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210296 pdf
Oct 19 2009YANG, HONG-BIN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210296 pdf
Oct 26 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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