Patent
   D617749
Priority
Jun 02 2009
Filed
Sep 09 2009
Issued
Jun 15 2010
Expiry
Jun 15 2024
Assg.orig
Entity
unknown
6
15
n/a
The ornamental design for a heat dissipation apparatus, as shown.

FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lin, Shan-Ju, Huang, Hsin-Fei

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 30 2009HUANG, HSIN-FEIFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232050403 pdf
Jul 30 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232050403 pdf
Sep 09 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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