Patent
   D619550
Priority
Jul 21 2009
Filed
Oct 26 2009
Issued
Jul 13 2010
Expiry
Jul 13 2024
Assg.orig
Entity
unknown
7
17
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Hwang, Jyh-Der, Yeh, Chao-Yi, Lin, Shan-Ju

Patent Priority Assignee Title
D663885, May 13 2011 ACF FINCO I LP Light fixture with heat sink
D696211, Oct 14 2011 Korea Bundy Co., Ltd. Heat exchange tube
D837170, Feb 15 2017 SAIJOINX Co., Ltd. Heat sink
D840958, Nov 15 2016 Borgwamer Emissions Systems Spain, S.L.U. Shaped tube with a pattern
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D851051, Feb 15 2017 SAIJOINX Co., Ltd. Heat sink
D851808, Dec 19 2016 RAB Lighting Inc. Light fixture with curved array of fins
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 19 2009HWANG, JYH-DERFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210387 pdf
Oct 19 2009YEH, CHAO-YIFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210387 pdf
Oct 19 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0234210387 pdf
Oct 26 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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