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Patent
D619551
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Priority
Jul 21 2009
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Filed
Nov 13 2009
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Issued
Jul 13 2010
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Expiry
Jul 13 2024
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Assg.orig
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Entity
unknown
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26
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15
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n/a
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The ornamental design for a heat dissipation device, as shown.
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FIG. 1 is a perspective view of a heat dissipation device of our new design.
FIG. 2 is a front elevational view thereof
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Yang, Hong-Bin, Lin, Shan-Ju
| Patent |
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Assignee |
Title |
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| Patent |
Priority |
Assignee |
Title |
| 6633484, |
Nov 20 2000 |
Intel Corporation |
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| 7487824, |
Aug 23 2006 |
HONG FU JIN PRECISION INDUSTRY SHENZHEN CO , LTD ; HON HAI PRECISION INDUSTRY CO , LTD |
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| 20020046826, |
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| 20040118552, |
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| 20050174780, |
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| 20070236935, |
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| 20080121377, |
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| 20090147520, |
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| 20090279314, |
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| 20100014287, |
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| 20100026158, |
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| D570504, |
Jun 18 2007 |
ACF FINCO I LP |
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| D576964, |
Nov 08 2007 |
ABL IP Holding LLC |
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| D592613, |
Jun 18 2008 |
4187318 CANADA INC |
Heat sink |
| D593963, |
Apr 23 2008 |
4187318 CANADA INC |
Modular heat sink |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a