FIG. 1 is a front perspective view of a chassis for electronic circuitry incorporating an ornamental design according to the present invention.
FIG. 2 is a back view of the chassis for electronic circuitry of FIG. 1.
FIG. 3 is a right side view of the chassis for electronic circuitry of FIG. 1.
FIG. 4 is a front view of the chassis for electronic circuitry of FIG. 1.
FIG. 5 is a top view of the chassis for electronic circuitry of FIG. 1.
FIG. 6 is a bottom view of the chassis for electronic circuitry of FIG. 1; and,
FIG. 7 is a left side view of the chassis for electronic circuitry of FIG. 1.
In the drawing, the broken lines depict unclaimed environment.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 27 2007 | | ADC Telecommunications, Inc. | (assignment on the face of the patent) | | / |
| Mar 27 2007 | WAYMAN, MICHAEL J | ADC Telecommunications, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019079 | /0119 |
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| Sep 30 2011 | ADC Telecommunications, Inc | TYCO ELECTRONICS SERVICES GmbH | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 036060 | /0174 |
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| Aug 28 2015 | CommScope EMEA Limited | CommScope Technologies LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 037012 | /0001 |
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