Patent
   D622679
Priority
Feb 04 2009
Filed
Jul 22 2009
Issued
Aug 31 2010
Expiry
Aug 31 2024
Assg.orig
Entity
unknown
18
12
n/a
The ornamental design for an light emitting diode package device, as shown and described.

FIG. 1 is a front view of a light emitting diode package device with the new design, having a Fresnel lens with circular patterns;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view of bottom side thereof.

The cross sectional views shown in FIG. 8 is included for the purpose of showing external surface contours which may not be clear from the remaining illustrations. Any features of internal construction shown are incidental and form no part of the claimed design.

Hsieh, Chung-Chuan

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 02 2009HSIEH, CHUNG-CHUANEVERLIGHT ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0229930544 pdf
Jul 22 2009Everlight Electronics Co., Ltd.(assignment on the face of the patent)
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