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Patent
D623150
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Priority
Feb 04 2009
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Filed
Jun 25 2009
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Issued
Sep 07 2010
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Expiry
Sep 07 2024
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Assg.orig
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Entity
unknown
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6
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14
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n/a
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The ornamental design for a light emitting diode package device, as shown and described.
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FIG. 1 is a front view of a light emitting diode package device with the new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a perspective view of bottom side thereof.
Hsieh, Chung-Chuan
Patent |
Priority |
Assignee |
Title |
7524087, |
Nov 16 2007 |
DOCUMENT SECURITY SYSTEMS, INC |
Optical device |
D490387, |
Nov 22 2001 |
Nichia Corporation |
Light emitting diode |
D494550, |
Aug 26 2003 |
Nichia Corporation |
Light emitting diode |
D495304, |
Nov 10 2003 |
SAMSUNG ELECTRONICS CO , LTD |
Light-emitting diode |
D547736, |
Dec 28 2001 |
Nichia Corporation |
Light emitting diode |
D584246, |
Mar 10 2006 |
DOMINANT OPTO TECHNOLOGIES SDN BHD |
High power light emitting diode |
D595674, |
Sep 24 2008 |
Harvatek Corporation |
Light emitting diode |
D596591, |
Feb 15 2008 |
DONGBU LED CO , LTD |
Light emitting diode |
D597971, |
Mar 13 2008 |
Rohm Co., Ltd. |
Light emitting diode module |
KR300432976, |
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TW531277, |
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TW584490, |
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TW584491, |
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TW584492, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a