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Patent
D626097
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Priority
Oct 16 2009
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Filed
Feb 09 2010
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Issued
Oct 26 2010
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Expiry
Oct 26 2024
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Assg.orig
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Entity
unknown
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15
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14
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n/a
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The ornamental design for a light-emitting diode, as shown and described.
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FIG. 1 is a front perspective view of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is a left side elevational view thereof.
Shimizu, Satoshi, Iwashita, Kazuhisa, Tonedachi, Tatsuo, Takeuchi, Teruo
Patent |
Priority |
Assignee |
Title |
D656110, |
Apr 28 2011 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
D656469, |
Apr 28 2011 |
Kabushiki Kaisha Toshiba |
Portion of a light-emitting diode |
D731989, |
Jun 06 2014 |
Nichia Corporation |
Light emitting diode chip |
D756942, |
May 06 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Light-emitting diode package |
D761215, |
May 06 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Package for light-emitting diode |
D763805, |
Jun 06 2014 |
Nichia Corporation |
Light emitting diode chip |
D768095, |
Oct 08 2015 |
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO , LTD |
Light-emitting diode package |
D825500, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D826184, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D831592, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D831593, |
Mar 24 2016 |
Hamamatsu Photonics K.K |
Optical semiconductor element |
D832802, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D846511, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D846512, |
Mar 24 2016 |
Hamamatsu Photonics K.K. |
Optical semiconductor element |
D847102, |
Feb 08 2013 |
EPISTAR CORPORATION |
Light emitting diode |
Patent |
Priority |
Assignee |
Title |
6677667, |
Nov 28 2000 |
National Semiconductor Corporation |
Leadless leadframe package design that provides a greater structural integrity |
6713317, |
Aug 12 2002 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device and laminated leadframe package |
6734536, |
Jan 12 2001 |
Rohm Co., Ltd. |
Surface-mounting semiconductor device and method of making the same |
7298034, |
Jun 28 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Multi-chip semiconductor connector assemblies |
20020121684, |
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20030122225, |
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20090057855, |
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D576571, |
Jun 14 2007 |
Rohm Co., Ltd. |
Light emitting diode module |
JP1066550, |
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JP1322677, |
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JP1325977, |
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JP1350595, |
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KR300419506, |
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KR300503678, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a