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Patent
D627312
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Priority
Feb 01 2010
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Filed
Apr 02 2010
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Issued
Nov 16 2010
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Expiry
Nov 16 2024
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Assg.orig
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Entity
unknown
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4
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30
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n/a
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The ornamental design for a light-emitting diode, as shown and described.
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FIG. 1 is a perspective view of a light-emitting diode showing our new design.
FIG. 2 is a front elevational view of the light-emitting diode of FIG. 1.
FIG. 3 is a rear elevational view of the light-emitting diode of FIG. 1.
FIG. 4 is a left-side, elevational view of the light-emitting diode of FIG. 1.
FIG. 5 is a right-side, elevational view of the light-emitting diode of FIG. 1.
FIG. 6 is a top plan view of the light-emitting diode of FIG. 1; and,
FIG. 7 is a bottom plan view of the light-emitting diode of FIG. 1.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Yang, Hong-Bin, Lai, Chih-Ming, Shiao, Ming-Young
Patent |
Priority |
Assignee |
Title |
6376902, |
Jul 29 1997 |
Osram GmbH |
Optoelectronic structural element |
6686609, |
Oct 01 2002 |
Ultrastar Limited |
Package structure of surface mounting led and method of manufacturing the same |
7102213, |
Sep 17 2002 |
OSRAM Opto Semiconductors GmbH; OSRAM OLED GmbH |
Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method |
7176612, |
Apr 21 2003 |
Sharp Kabushiki Kaisha |
LED device and portable telephone, digital camera and LCD apparatus using the same |
7385227, |
Apr 12 2005 |
BENCH WALK LIGHTING LLC |
Compact light emitting device package with enhanced heat dissipation and method for making the package |
7514724, |
Mar 23 2007 |
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED |
Solid state light source having a variable number of dies |
7547583, |
May 01 2006 |
DOCUMENT SECURITY SYSTEMS, INC |
Light emitting diode package with direct leadframe heat dissipation |
7635915, |
Apr 26 2006 |
CREELED, INC |
Apparatus and method for use in mounting electronic elements |
7675145, |
Mar 28 2006 |
CREELED, INC |
Apparatus, system and method for use in mounting electronic elements |
7696526, |
Jan 29 2004 |
Dominant Opto Technologies SDN BHD |
Surface mount optoelectronic component |
7719024, |
May 10 2006 |
Nichia Corporation |
Semiconductor light emitting device and a method for producing the same |
20020163001, |
|
|
|
20040201028, |
|
|
|
20050127816, |
|
|
|
20060163705, |
|
|
|
20070145403, |
|
|
|
20070252250, |
|
|
|
D471166, |
Apr 06 2001 |
Kabushiki Kaisha Toshiba |
Light emitting semiconductor device |
D488137, |
Jan 30 2002 |
Nichia Corporation |
Light emitting diode |
D491899, |
May 22 2002 |
Nichia Corporation |
Light emitting diode |
D494550, |
Aug 26 2003 |
Nichia Corporation |
Light emitting diode |
D495304, |
Nov 10 2003 |
SAMSUNG ELECTRONICS CO , LTD |
Light-emitting diode |
D505398, |
Jun 24 2003 |
Nichia Corporation |
Light emitting diode |
D510913, |
Sep 09 2003 |
Nichia Corporation |
Light emitting diode |
D568261, |
Oct 12 2006 |
SAMSUNG ELECTRONICS CO , LTD |
Light-emitting diode |
D576966, |
Jun 26 2006 |
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED |
Light emitting diode |
D599749, |
Dec 09 2005 |
Nichia Corporation |
Light emitting diode |
D602451, |
May 20 2008 |
PHILIPS LIGHTING HOLDING B V |
LED module |
D611011, |
Apr 22 2009 |
Kabushiki Kaisha Toshiba |
Portion of light-emitting diode |
D621800, |
Dec 12 2008 |
Everlight Electronics Co., Ltd. |
Light-emitting diode device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a