FIG. 1 is a top front perspective view of a laser complex showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 01 2009 | PARK, JI-SANG | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 023211 | /0419 |
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Aug 01 2009 | KIM, CHUNG-HA | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 023211 | /0419 |
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Aug 17 2009 | | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | | / |
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