Patent
   D635528
Priority
Nov 11 2009
Filed
May 04 2010
Issued
Apr 05 2011
Expiry
Apr 05 2025
Assg.orig
Entity
unknown
0
9
n/a
The ornamental design for a led module, as shown.

FIG. 1 is a perspective view showing my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Nitsch, Manfred, Bembridge, Mathew Lee

Patent Priority Assignee Title
Patent Priority Assignee Title
6700138, Feb 25 2002 SILICON BANDWIDTH, INC Modular semiconductor die package and method of manufacturing thereof
7505275, Nov 04 2005 NeoGraf Solutions, LLC LED with integral via
20040222426,
20060071222,
20070228387,
208474,
D523826, Apr 25 2003 Nichia Corporation Light emitting diode
D567773, Jan 31 2006 Nichia Corporation Light emitting diode
D568832, Oct 30 2006 SEOUL SEMICONDUCTOR CO , LTD Light emitting diode (LED)
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Apr 22 2010NITSCH, MANFREDKoninklijke Philips Electronics N VASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0246700486 pdf
Apr 22 2010BEMBRIDGE, MATKoninklijke Philips Electronics N VASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0246700486 pdf
May 04 2010Koninklijke Philips Electronics N.V.(assignment on the face of the patent)
May 15 2013Koninklijke Philips Electronics N VKONINKLIJKE PHILIPS N V CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0421280041 pdf
Oct 07 2016KONINKLIJKE PHILIPS N V PHILIPS LIGHTING HOLDING B V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0421070720 pdf
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