Patent
   D652332
Priority
Mar 05 2010
Filed
Mar 05 2010
Issued
Jan 17 2012
Expiry
Jan 17 2026
Assg.orig
Entity
unknown
10
14
n/a
We claim the ornamental design for a molded fingerprint sensor structure with indicia regions, as shown and described.

FIG. 1 is a perspective view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 2 is a left side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 3 is a front elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 4 is a back elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 5 is a bottom view of a fingerprint sensor chip with integrally molded bezels including indicia regions;

FIG. 6 is a top view of a fingerprint sensor chip with integrally molded bezels including indicia regions; and,

FIG. 7 is a right side elevation view of a fingerprint sensor chip with integrally molded bezels including indicia regions.

The broken lines depict unclaimed environmental subject matter.

Kramer, Alan, Gozzini, Giovanni, Bond, Robert Henry

Patent Priority Assignee Title
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Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 04 2010BOND, ROBERT H UPEK, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0240380906 pdf
Mar 04 2010KRAMER, ALANUPEK, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0240380906 pdf
Mar 04 2010GOZZINI, GIOVANNIUPEK, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0240380906 pdf
Mar 05 2010Authentec, Inc.(assignment on the face of the patent)
Sep 01 2011UPEK, INC AUTHENTEC, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0269440942 pdf
Feb 10 2013AUTHENTEC, INC Apple IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355520286 pdf
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