FIG. 1 is a perspective view of the headphone assembly from the side;
FIG. 2 shows a bottom side view of the headphone assembly;
FIG. 3 shows a top view of the headphone assembly;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is an end elevational view thereof; and,
FIG. 7 is an opposite end elevational view thereof.
The broken lines form no part of the claimed design.
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Earphone |
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Head phone |
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Headset |
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Headphones |
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Headphones |
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Headset |
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Headset |
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Headset with boom microphone |
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Headphone |
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Headphone |
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LG Electronics Inc |
Wireless headset |
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Headphone |
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Headset |
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Headphones |
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Jan 03 2011 | WANG, WILLIAM | Vizio, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025590 | /0179 |
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Jan 03 2011 | MCRAE, MATHEW | Vizio, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025590 | /0179 |
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Jan 03 2011 | MCMANIGAL, SCOTT | Vizio, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025590 | /0179 |
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Jan 05 2011 | | Vizio Inc. | (assignment on the face of the patent) | | / |
Apr 13 2016 | VIZIO INSCAPE SERVICES, LLC | BANK OF AMERICA, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 038663 | /0092 |
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Apr 13 2016 | VIZIO Inscape Technologies, LLC | BANK OF AMERICA, N A | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 038663 | /0092 |
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Apr 12 2024 | BANK OF AMERICA, N A | Vizio, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 067123 | /0675 |
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Apr 12 2024 | BANK OF AMERICA, N A | INSCAPE DATA, INC F K A VIZIO INSCAPE TECHNOLOGIES, LLC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 067123 | /0675 |
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