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					| Patent    D658606 |  
					| Priority Sep 29 2010 |  
					| Filed Dec 17 2010 |  
					| Issued May 01 2012 |  
					| Expiry May 01 2026 |  
					|  |  
					| Assg.orig |  
					|  |  
					| Entity unknown |  
					 | 2 |  
					 | 22 |  
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			  The ornamental design for a portion of a light-emitting diode, as shown and described. | 
 
	
FIG. 1 is a front perspective view of a portion of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a left side elevational view thereof;
FIG. 9 is a front perspective view of a portion of a light-emitting diode of FIG. 1; and,
FIG. 10 is a rear perspective view of a portion of a light-emitting diode of FIG. 1.
The broken line showing of the remainder of the light-emitting diode is for illustrative purpose only and forms no part of the claimed design.
	
	Shimizu, Satoshi, Iwashita, Kazuhisa, Tonedachi, Tatsuo, Inoue, Kazuhiro, Takeuchi, Teruo
	
	
	
	
	  
 	  	 | Patent | Priority | Assignee | Title | 
	      
	 | 6583447, | Aug 27 2001 | Harvatek Corp. | Multiple LED chip package | 
    
	 | 6686609, | Oct 01 2002 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same | 
    
	 | 6858870, | Jun 10 2003 | Galaxy PCB Co., Ltd. | Multi-chip light emitting diode package | 
    
	 | 7067848, | Mar 21 2005 |  | High intensity LED | 
    
	 | 7208738, | Feb 28 2005 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE  LIMITED | Light source utilizing an infrared sensor to maintain brightness and color of an LED device | 
    
	 | 7455423, | Apr 28 2005 | XIAMEN SAN AN OPTOELECTRONICS CO , LTD | Semiconductor light emitting device | 
    
	 | 7478923, | Mar 16 2007 | Gemmy Industries Corporation | Multicolor light-emitting diode light string and light-emitting diode component thereof | 
    
	 | 7528421, | May 05 2003 | ACF FINCO I LP | Surface mountable light emitting diode assemblies packaged for high temperature operation | 
    
	 | 7714347, | Jun 13 2006 | Lighthouse Technology Co., Ltd. | Casting for an LED module | 
    
	 | 7964886, | Apr 08 2005 | XIAMEN SAN AN OPTOELECTRONICS CO , LTD | Light emitting diode | 
    
	 | 20020190262, |  |  |  | 
    
	 | 20040056265, |  |  |  | 
    
	 | D622683, | Apr 08 2009 | Nichia Corporation | Light emitting diode module | 
    
	 | D624032, | Oct 16 2009 | Kabushiki Kaisha Toshiba | Light-emitting diode | 
    
	 | D624033, | Oct 16 2009 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode | 
    
	 | D644190, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Light-emitting diode | 
    
	 | D644191, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode | 
    
	 | JP1322677, |  |  |  | 
    
	 | JP1375900, |  |  |  | 
    
	 | KR300379639, |  |  |  | 
    
	 | KR300379641, |  |  |  | 
    
	 | KR30037964101, |  |  |  | 
	
	
	
	
	
	  
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