FIG. 1 is a perspective view of a profilometer;
FIG. 2 is a front view thereof;
FIG. 3 is a left-side view thereof;
FIG. 4 is a right-side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a back view thereof;
FIG. 7 is an enlarged view of portion 7-7 of FIG. 2;
FIG. 8 is an enlarged view of portion 8-8 of FIG. 3;
FIG. 9 is an enlarged view of portion 9-9 of FIG. 4;
FIG. 10 is an enlarged view of portion 10-10 of FIG. 5;
FIG. 11 is an enlarged view of portion 11-11 of FIG. 6;
FIG. 12 is an enlarged view of portion 12-12 of FIG. 1;
FIG. 13 is a perspective view of the profilometer; and,
FIG. 14 is an illustrative view of the profilometer thereof removed to disclose details not otherwise visible.
The subject article is a profilometer used for measuring a surface profile (such as the extent of flatness) of a thin disk object (such as a silicon wafer).
The broken lines in the drawings depict unclaimed environmental subject matter.