Patent
   D659654
Priority
Jan 05 2011
Filed
Jun 26 2011
Issued
May 15 2012
Expiry
May 15 2026
Assg.orig
Entity
unknown
0
9
n/a
The ornamental design for a “LED package base,” as shown and described.

FIG. 1 is a perspective view of a “LED package base” showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a perspective view showing the practical usage.

Wang, Bily

Patent Priority Assignee Title
Patent Priority Assignee Title
7242035, Jan 28 2005 SAMSUNG ELECTRONICS CO , LTD Side view LED package having lead frame structure designed to improve resin flow
7910948, Jun 12 2008 Alti-Electronics Co., Ltd. Light emitting diode package
7935982, Jun 27 2006 Seoul Semiconductor Co., Ltd. Side view type LED package
7968900, Jan 19 2007 CREELED, INC High performance LED package
D534132, Mar 23 2005 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
D558693, Oct 11 2006 SAMSUNG ELECTRONICS CO , LTD Light-emitting diode
D599305, May 21 2008 DONGBU LED CO , LTD Light emitting diode
D633053, Dec 11 2009 Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD Light emitting diode
D637981, Feb 05 2010 Lextar Electronics Corporation Lead frame
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Jun 20 2011WANG, BILYHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0265000514 pdf
Jun 26 2011Harvatek Corporation(assignment on the face of the patent)
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