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Patent
D659654
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Priority
Jan 05 2011
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Filed
Jun 26 2011
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Issued
May 15 2012
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Expiry
May 15 2026
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Assg.orig
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Entity
unknown
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0
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9
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n/a
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The ornamental design for a “LED package base,” as shown and described.
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FIG. 1 is a perspective view of a “LED package base” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view showing the practical usage.
Wang, Bily
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
7242035, |
Jan 28 2005 |
SAMSUNG ELECTRONICS CO , LTD |
Side view LED package having lead frame structure designed to improve resin flow |
7910948, |
Jun 12 2008 |
Alti-Electronics Co., Ltd. |
Light emitting diode package |
7935982, |
Jun 27 2006 |
Seoul Semiconductor Co., Ltd. |
Side view type LED package |
7968900, |
Jan 19 2007 |
CREELED, INC |
High performance LED package |
D534132, |
Mar 23 2005 |
Seoul Semiconductor Co. Ltd. |
Light emitting diode (LED) |
D558693, |
Oct 11 2006 |
SAMSUNG ELECTRONICS CO , LTD |
Light-emitting diode |
D599305, |
May 21 2008 |
DONGBU LED CO , LTD |
Light emitting diode |
D633053, |
Dec 11 2009 |
Everlight Electronics Co., Ltd.; EVERLIGHT ELECTRONICS CO , LTD |
Light emitting diode |
D637981, |
Feb 05 2010 |
Lextar Electronics Corporation |
Lead frame |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a