FIG. 1 is a front perspective view of a case for a mobile computing device;
FIG. 2 is a front view of a case for a mobile computing device;
FIG. 3 is a back view of a case for a mobile computing device;
FIG. 4 is a bottom end view of a case for a mobile computing device;
FIG. 5 is a top end view of a case for a mobile computing device;
FIG. 6 is a left side view of a case for a mobile computing device; and,
FIG. 7 is a right side view of a case for a mobile computing device.
The broken line portions are not claimed.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 07 2011 | | Hewlett-Packard Development Company, L.P. | (assignment on the face of the patent) | | / |
| May 09 2011 | VAN DEN NIEUWENHUIZEN, JOHN | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 026299 | /0169 |
pdf |
| May 09 2011 | LEE, SEUNGHEON | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 026299 | /0169 |
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| Apr 30 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030341 | /0459 |
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| Dec 18 2013 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0239 |
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| Dec 18 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0544 |
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| Jan 23 2014 | Hewlett-Packard Company | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 |
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| Jan 23 2014 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 |
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| Jan 23 2014 | Palm, Inc | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 |
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