The present application is related to copending U.S. patent application Ser. Nos. 29/415,338, 29/415,537, 29/415,532, 29/415,534, 29/415,340, 29/415,530, 29/415,529, 29/415,528, 29/415,526, 29/415,524, 29/415,523, 29/415,521, 29/415,634, 29/415,633, 29/415,520, 29/415,632, 29/415,629, 29/415,628, 29/415,635, 29/415,630, 29/415,636, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a side elevational view thereof; and,
FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.
In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the cover of an electronic device having surface ornamentation that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.