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The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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The present application is related to copending U.S. patent application Ser. Nos. 29/415,747, 29/415,748, 29/415,749, 29/415,897, 29/415,900, and 29/415,901, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 07 2012 | LI, BIN | FIH HONG KONG LIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027860 | /0221 | |
Mar 14 2012 | FIH (Hong Kong) Limited | (assignment on the face of the patent) | / |
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