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The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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The present application is related to copending U.S. patent applications Ser. Nos. 29/418,361, 29/418,363, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,372, 29/418,373, 29/418,375, 29/418,377, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 12 2012 | LI, BIN | FIH HONG KONG LIMITED | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 028051 | /0704 | |
Apr 16 2012 | FIH (Hong Kong) Limited | (assignment on the face of the patent) | / |
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