Patent
   D668648
Priority
Jun 01 2012
Filed
Jun 01 2012
Issued
Oct 09 2012
Expiry
Oct 09 2026
Assg.orig
Entity
unknown
1
23
n/a
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.

The present application is related to copending U.S. patent applications Ser. Nos. 29/423,547, 29/423,548, 29/423,549, 29/423,552, 29/423,555, 29/423,557, 29/423,559 and 29/423,560, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Li, Bin

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May 30 2012LI, BINFIH HONG KONG LIMITEDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0283050069 pdf
Jun 01 2012FIH (Hong Kong) Limited(assignment on the face of the patent)
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