The ornamental design for a cover of an electronicdevice having surface ornamentation, as shown and described.
The present application is related to copending U.S. patent applications Ser. Nos. 29/415,746, 29/415,897, 29/415,747, 29/415,748, 29/415,901, and 29/415,749, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
FIG. 1 is a perspective view of a cover of an electronic device with surface pattern showing my new design;
FIG. 2 is a front elevational view thereof; and,
FIG. 3 is a side elevational view thereof.
In the drawings, the broken lines depict unclaimed portions of the cover of an electronic device having surface ornamentation. The broken lines form no part of the claimed design.