Patent
   D672759
Priority
Jul 24 2012
Filed
Jul 24 2012
Issued
Dec 18 2012
Expiry
Dec 18 2026
Assg.orig
Entity
unknown
2
23
n/a
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.

The present application is related to copending U.S. patent applications Ser. Nos. 29/427,899, 29/427,901, 29/427,902, 29/427,904, 29/427,906, 29/427,908, and 29/427,910, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Li, Bin

Patent Priority Assignee Title
D704180, Mar 06 2012 FIH (Hong Kong) Limited Cover of an electronic device having surface ornamentation
D709056, Oct 18 2013 Fu Ding Electronical Technology (Jianshan) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. Housing
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 16 2012LI, BINFIH HONG KONG LIMITEDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0286930575 pdf
Jul 24 2012FIH (Hong Kong) Limited(assignment on the face of the patent)
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