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Patent
D674360
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Priority
Mar 30 2012
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Filed
Mar 30 2012
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Issued
Jan 15 2013
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Expiry
Jan 15 2027
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Assg.orig
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Entity
unknown
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2
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22
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n/a
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The ornamental design for a “LED package,” as shown and described.
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FIG. 1 is a perspective view of a “LED package” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and
FIG. 8 is a perspective view viewed from another visual angle thereof; and,
FIG. 9 is a perspective view with a LED chip showing the practical usage thereof.
The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.
Lin, Chen-Hsiu, Chang, Yi-Chien
Patent |
Priority |
Assignee |
Title |
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Jun 30 2005 |
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Light-emitting device |
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20120193659, |
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D624032, |
Oct 16 2009 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
D637565, |
Nov 02 2010 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Light emitting diode |
D644190, |
Sep 29 2010 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
D644191, |
Sep 29 2010 |
Kabushiki Kaisha Toshiba |
Portion of a light-emitting diode |
D646643, |
Nov 02 2010 |
LITE-ON ELECTRONICS GUANGZHOU LIMITED |
Light emitting diode |
D649943, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D650343, |
Jan 31 2011 |
CREELED, INC |
Multiple configuration light emitting device package |
D658139, |
Jan 31 2011 |
CREE LED, INC |
High-density emitter package |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a