PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D674757
|
Priority
Oct 31 2011
|
Filed
Jan 03 2012
|
Issued
Jan 22 2013
|
Expiry
Jan 22 2027
|
|
Assg.orig
|
|
Entity
unknown
|
2
|
34
|
n/a
|
|
|
The ornamental design for package carrier of light emitting diode, as shown and described.
|
FIG. 1 is a perspective view of package carrier of light emitting diode showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The portions shown in dashed lines are for illustrative purposes only and form no part of the claimed design.
Lin, Chen-Hsiu, Wu, Chia-Hao, Chang, Yi-Chien, Weng, Ming-Kun
Patent |
Priority |
Assignee |
Title |
6686609, |
Oct 01 2002 |
Ultrastar Limited |
Package structure of surface mounting led and method of manufacturing the same |
6858870, |
Jun 10 2003 |
Galaxy PCB Co., Ltd. |
Multi-chip light emitting diode package |
7067848, |
Mar 21 2005 |
|
High intensity LED |
7821023, |
Jan 10 2005 |
CREELED, INC |
Solid state lighting component |
7960744, |
Jun 29 2007 |
Seoul Semiconductor Co., Ltd.; SEOUL SEMICONDUCTOR CO , LTD |
Multi-light emitting diode package |
8124988, |
May 28 2008 |
SEMISILICON TECHNOLOGY CORP. |
Light emitting diode lamp package structure and assembly thereof |
20020190262, |
|
|
|
20090108281, |
|
|
|
20100117099, |
|
|
|
20100123144, |
|
|
|
20100127283, |
|
|
|
20100140633, |
|
|
|
20100140634, |
|
|
|
20100252851, |
|
|
|
20110006317, |
|
|
|
20110062482, |
|
|
|
20110210346, |
|
|
|
20110248289, |
|
|
|
20120138967, |
|
|
|
20120199852, |
|
|
|
D615504, |
Oct 31 2007 |
CREELED, INC |
Emitter package |
D622683, |
Apr 08 2009 |
Nichia Corporation |
Light emitting diode module |
D628169, |
Apr 08 2009 |
Nichia Corporation |
Light emitting diode module |
D631019, |
Apr 21 2010 |
EPISTAR CORPORATION |
Light emitting diode packaging array |
D631020, |
Apr 29 2010 |
Edison Opto Corporation |
LED package |
D644190, |
Sep 29 2010 |
Kabushiki Kaisha Toshiba |
Light-emitting diode |
D645416, |
Dec 22 2009 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light-emitting diode |
D649943, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D649944, |
Jul 07 2010 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Light emitting diode |
D650343, |
Jan 31 2011 |
CREELED, INC |
Multiple configuration light emitting device package |
D656906, |
Jan 10 2008 |
CREELED, INC |
LED package |
D658139, |
Jan 31 2011 |
CREE LED, INC |
High-density emitter package |
D660257, |
Jan 31 2011 |
CREE LED, INC |
Emitter package |
D660258, |
May 04 2011 |
EPISTAR CORPORATION |
Light emitting diode |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 26 2011 | CHANG, YI-CHIEN | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | WENG, MING-KUN | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | LIN, CHEN-HSIU | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | WU, CHIA-HAO | LITE-ON TECHNOLOGY CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | CHANG, YI-CHIEN | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | WENG, MING-KUN | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | LIN, CHEN-HSIU | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Dec 26 2011 | WU, CHIA-HAO | SILITEK ELECTRONIC GUANGZHOU CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027520 | /0343 |
pdf |
Jan 03 2012 | | Lite-On Technology Corp. | (assignment on the face of the patent) | | / |
Jan 03 2012 | | Silitek Electronics (Guangzhou) Co., Ltd. | (assignment on the face of the patent) | | / |
Jul 31 2012 | SILITEK ELECTRONIC GUANGZHOU CO , LTD | LITE-ON ELECTRONICS GUANGZHOU LIMITED | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 030416 | /0787 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a