The ornamental design for an LED-array package, as shown and described.
FIG. 1 is a perspective view of the LED-array package, a lens and light-emitting diodes (LEDs) being shown in phantom lines;
FIG. 2 is a front view of the LED-array package of FIG. 1;
FIG. 3 is a rear view of the LED-array package of FIG. 1;
FIG. 4 is a right-side elevation of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof;
FIG. 5 is a top plan view of the LED-array package of FIG. 1;
FIG. 6 is a bottom plan view of the LED-array package of FIG. 1;
FIG. 7 is a perspective view of a submount portion of the LED-array package of FIG. 1;
FIG. 8 is a front view of the submount portion of the LED-array package of FIG. 1;
FIG. 9 is a rear view of the submount portion of the LED-array package of FIG. 1;
FIG. 10 is a right-side elevation of the submount portion of the LED-array package of FIG. 1, the left-side elevation view being a mirror image thereof; and,
FIG. 11 is a top plan view of the submount portion of the LED-array package of FIG. 1.
Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product