Flip-cover for an electronic device

Abstract

Description

FIG. 1 is a perspective view of flip-cover for an electronic device in accordance with the present invention

FIG. 2 is a front view of FIG. 1;

FIG. 3 is a rear view of FIG. 1;

FIG. 4 is a top view of FIG. 1;

FIG. 5 is a bottom view of FIG. 1;

FIG. 6 is a left side view of FIG. 1; and,

FIG. 7 is a right side view of FIG. 1.

In one embodiment, the dimension for the flip-cover is approximately 105×139×2.5 mm.

In one embodiment, the flip-cover the flip-cover includes a metal connecting piece and a leather cover.

In one embodiment, the flip-cover the flip-cover includes a metal connecting piece with a thickness of 2.5 mm and a leather cover with a thickness of 2 mm.

Claims

The ornamental design for a flip-cover for an electronic device, as shown and described.