Patent
   D708150
Priority
Aug 12 2011
Filed
Oct 25 2013
Issued
Jul 01 2014
Expiry
Jul 01 2028
Assg.orig
Entity
unknown
2
9
n/a
The ornamental design for a backplane module, as shown and described.

FIG. 1 is a perspective view of a backplane module according to the present design;

FIG. 2 is a front view of the backplane module shown in FIG. 1;

FIG. 3 is a rear view of the backplane module shown in FIG. 1;

FIG. 4 is a left side view of the backplane module shown in FIG. 1;

FIG. 5 is a right side view of the backplane module shown in FIG. 1;

FIG. 6 is a top view of the backplane module shown in FIG. 1; and,

FIG. 7 is a bottom view of the backplane module shown in FIG. 1.

The broken line showing of the backplane module is for illustrative purposes only and forms no part of the claimed design.

Cech, Markus, Veit, Andreas, Bell, Andreas, Winkler, Markus, Baumgartner, Klaus

Patent Priority Assignee Title
D732537, Jan 18 2013 MERCURY MISSION SYSTEMS, LLC Removable device interface with attached devices
D733144, May 14 2013 MERCURY MISSION SYSTEMS, LLC Removable device interface
Patent Priority Assignee Title
4790762, Jul 23 1985 HONEYWELL INC , HONEYWELL PLAZA, MINNEAPOLIS, MINNESOTA 55408 A CORP OF DE Backplane for a modularly expandable programmable controller
5348482, Jun 11 1993 WHITAKER CORPORATION, THE High density integrated backplane assembly
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Oct 25 2013Pilz GmbH & Co. KG(assignment on the face of the patent)
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