Patent
   D720376
Priority
Feb 14 2013
Filed
Aug 14 2013
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
1
3
n/a
We claim, the ornamental design for a vacuum package machine, as shown and described.

FIG. 1 is the front perspective view of a vacuum package machine showing our new design;

FIG. 2 is the front elevation view thereof;

FIG. 3 is the rear elevation view thereof;

FIG. 4 is the left-side elevation view thereof;

FIG. 5 is the right-side elevation view thereof;

FIG. 6 is the top-side plan view thereof;

FIG. 7 is the bottom-side plan view thereof; and,

FIG. 8 is a front elevation view thereof, showing the vacuum package machine in a refrigerator environment.

The surface treatment of the vacuum package machine shown in the figures forms no part of the claimed design, a vacuum package machine according to the claimed design may have any surface treatment.

The broken lines illustrating portions of the vacuum package machine are for environmental purposes only and form no part of the claimed design.

Ryu, Jinie, Hyun, Sangmin, Kwon, Jongchan, Lee, Yangjic, Moon, Ji Hyun

Patent Priority Assignee Title
D916938, Mar 26 2019 Packing machine
Patent Priority Assignee Title
5097649, Apr 24 1990 Shikoku Kakoki Co., Ltd. Packaging machine
D301890, Apr 18 1986 Aktiebolaget Tetra Pak Packaging machine
D567271, Mar 17 2006 ISHIDA EUROPE LIMITED Packaging machine
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Jul 23 2013RYU, JINIESAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0310080258 pdf
Jul 23 2013KWON, JONGCHANSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0310080258 pdf
Jul 23 2013MOON, JI HYUNSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0310080258 pdf
Jul 23 2013LEE, YANGJICSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0310080258 pdf
Jul 23 2013HYUN, SANGMINSAMSUNG ELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0310080258 pdf
Aug 14 2013Samsung Electronics Co., Ltd.(assignment on the face of the patent)
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